Dynamic mea-
sured instrument

• Laser Vibrometer
  (LDV)
• Polytec
• Shaker in-
  strument (LDS)
• Rate table
  instrument
• Lynceetec

Static mea-
sured instrument

• Thin Film Mea-
  surement System
• AFM
• Optical microscope
• SEM
• LCR meter
  &Probe Station
• Network analyzer
• 真空腔
• Optical Pro-
  filing System
• IR camera
• Manual Flip-Chip bonder
• White Light Interferometry(ZYGO)
• Confocal Laser Scanning Microscope(Keyence)
• Metallurgical Microscope(Olympus)

Fabricated facility

• Thermal Pyrolysis
  Chemical Vapor
  Deposition System
• Parylene Depo-
  sited System
• E-gun
• Electroplating
  system

IR camera

• Feature: high performance thermal imaging camera
• Temperature range: 5 ℃ - 300 ℃, 300 ℃ - 500 ℃
• bservation window size: about 1.5 mm × 1.0 mm
• Resolution: 3 μm
• Frame rate: 100 Hz

Manual Flip-Chip bonder

• Die size：2 mm × 2 mm, 1.5 mm × 1.5 mm
• Heating temperature：400 ℃
• Bonding force：0.1~30 N
• Alignment tolerance：1 μm