1. W. Fang, 1999, “Determining of Elastic Constants of Thin Film Materials Using Self-deformed Micromachined Cantilevers,” Journal of Micromechanics and Microengineering, Vol. 9, pp. 230-235. (Corresponding author)
  2. W. Fang, C.-H. Lee, and H.-H. Hu, 1999, “On the Buckling Behavior of Micromachined Beams,” Journal of Micromechanics and Microengineering, Vol. 9, pp. 236-244. (Corresponding author)
  3. J. Hsieh and W. Fang, 2000, “A Novel Microelectrostatic Torsional Actuator,” Sensors and Actuators A, Vol. 79, pp. 64-70. (Corresponding author)
  4. C. Tsou and W. Fang, 2000, “The Effect of Residual Stresses on the Deformation of Semi-circular Micromachined Beams,” Journal of Micromechanics and Microengineering, Vol. 10, pp. 34-41. (Corresponding author)
  5. H.-Y. Lin and W. Fang, 2000, “The Rib-Reinforced Micromachined Beam and Its Application,” Journal of Micromechanics and Microengineering, Vol. 10, pp 93-99. (Corresponding author)
  6. S.-T. Hung, S.-C. Wong, and W. Fang, 2000, “The Development and Appication of Micro Thermal Sensors with a Supporting Mesh-Membrane Structure,” Sensors and Actuators A Vol. 84, pp. 70-75. (Corresponding author)
  7. W. Fang, and C.-Y. Lo, 2000, “On the Thermal Expansion Coefficients of Thin Films,” Sensors and Actuators A, Vol. 84, pp. 310-314. (Corresponding author)
  8. C. Tsou, H. Yin, and W. Fang, 2001, “On the Out-of-plane Deformation of V-shaped Micromachined Beams,” Journal of Micromechanics and Microengineering, Vol. 11, pp. 153-160. (Corresponding author)
  9. C.-A. Jong, W. Fang, C.-M. Lee, and T.-S. Chin, 2001 “Mechanical properties of phase-change recording media: GeSbTe films,” Japanese Journal of Applied Physics Vol. 40, pp. 3320-3325. (Collaboration with Prof. Chin at MSE Dept., NTHU)
  10. W.-P. Lai, and W. Fang, 2001, “A Novel Anti-Stiction Method Using Harmonic Excitation on the Microstructure,” Journal of Vacuum Science and Technology A Vol. 19, pp. 1224-1228. (Corresponding author)
  11. H.-H. Hu, H.-Y. Lin, B.C.-S. Chou, and W. Fang, 2001, “The diagnostic micromachined beams on (111)substrate,” Sensors and Actuators A, Vol. 93, pp. 258-265. (Corresponding author)
  12. C.-A. Jong, T.-S. Chin, and W. Fang, 2001, “Residual stress and thermal expansion behavior of TaOxNy films by the micro-cantilever method,” Thin Solid Films, Vol. 401, pp. 291-297. (Collaboration with Prof. Chin at MSE Dept., NTHU)
  13. W.-P. Lai, and W. Fang, 2002, “Novel Bulk Acoustic Wave Hammer to Determinate the Dynamic Response of Microstructures Using Pulsed Broad Bandwidth Ultrasonic Transducers,” Sensors and Actuators A, Vol. 96, pp. 43-52. (Corresponding author)
  14. J. Hsieh and W. Fang, 2002, “A Boron Etch-stop Assisted Lateral Silicon Etching Process for Improved High-aspect-ratio Silicon Micromachining and Its Applications,” Journal of Micromechanics and Microengineering, Vol. 12, pp. 574-581. (Corresponding author)
  15. W.-P. Lai and W. Fang, 2002, “Improvement of Bulk Acoustic Wave Hammer for Vibration Testing of Microstructures Using 1-3 Composite Transducer,” Sensors and Actuators A, Vol. 101, pp. 99-106. (Corresponding author)
  16. W.-C. Chen, C.-C. Chu, J. Hsieh, and W. Fang, 2003, “A Reliable Single-layer Out-of-plane Micromachined Thermal Actuator,” Sensors and Actuators A, Vol. 103, pp. 48-58. (Corresponding author)
  17. H.-C. Tsai and W. Fang, 2003, “Determining the Poisson’s Ratio of Thin Film Materials Using Resonant Method,” Sensors and Actuators A, Vol. 103, pp. 377-383. (Corresponding author)
  18. H.-Y. Lin and W. Fang, 2003, “A Reinforced Micro-torsional-mirror Driven by Electrostatic Torque Generators,” Sensors and Actuators A, Vol. 105, pp. 1-9. (Corresponding author)
  19. W. Tan, M. Wu, and W. Fang, 2003, “Novel MUMPs-compatible single-layer Out-of-plane Electrothermal Actuator,” Journal of Microlithography, Microfabrication and Microsystems, Vol. 2, pp. 91-95. (Corresponding author)
  20. Y.-J. Lai, C. Lee, C.-Y. Wu, W.-C. Chen, C. Chen, Y.-S. Lin,W. Fang, and R.-S. Huang, 2003, “Development of electrothermal actuator with optimized motion characteristics,”Jap. J. of Appl. Phys., Vol. 42, pp. 4067-4073.
  21. J. M.-L. Tsai, H.-Y. Chu, J. Hsieh, and W. Fang, 2004, “The BELST II Process for Silicon HARM Vertical Comb Actuator and Its Applications,” Journal of Micromechanics and Microengineering, Vol. 14, pp. 235-241.
  22. H.-Y. Chu and W. Fang, 2004, “A Novel Vertical Convex Corner Compensation for Wet Anisotropic Bulk Micromachining,” Journal of Micromechanics and Microengineering, Vol. 14, pp. 806-831.
  23. S.-H. Shen, W. Fang, S.-T. Young, 2004, “Design Considerations for an Acoustic MEMS Filter,” Microsystem Technologies, Vol. 10, pp. 585-591.
  24. H. Hocheng, K.S. Kao, and W. Fang, 2004, “Fatigue Life of a Microcantilever Beam in Bending”, Journal of Vacuum Science Technology A, Vol. 22, pp. 3143-3146.
  25. C. Yu, C. Hsu, and W. Fang, 2005, “Comments on Determining the Elastic Modulus of Thin Film Using the Micromachined Free-Free Beam,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 351-357.
  26. H. Yang, M. Wu, and W. Fang, 2005, “Localized Induction Heating Solder Bonding for Wafer Level MEMS Packaging,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 394-399.
  27. W.-P. Lai and W. Fang, 2005, “Determining the In-plane and Out-of-plane Dynamic Response of Microstructures Using Pulsed Dual-Mode Ultrasonic Array Transducers,” Sensors and Actuators A, Vol. 117, pp. 186-197.
  28. M. Wu, and W. Fang, 2005, “Design and Fabrication of MEMS Devices Using the Integration of MUMPs, Trench-refilled Molding, DRIE, and Bulk Silicon Etching Processes,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 535-542.
  29. C. Tsou, C. Hsu, and W. Fang, 2005, “Interfaces Friction Effect of Sliding Contact on Nanoindentation Test,” Sensors and Actuators A, Vol. 117, pp. 309-316.
  30. C.-C. Cheng and W. Fang, 2005, “Tuning the Quality Factor of Bulk Micromachined Structures Using the Squeeze Film Damping,” Microsystem Technologies, Vol. 11, pp. 104-110.
  31. H.-Y. Chu and W. Fang, 2005, “Bulk Micromachining Fabrication Platform Using the Integration of DRIE and Wet Anisotropic Etching,” Microsystem Technologies, Vol. 11, pp. 141-150.
  32. Y.-P. Ho, M. Wu, H.-Y. Lin, and W. Fang, 2005, “A Robust and Reliable Stress-induced Self-assembly Supporting Mechanism for Optical Devices,” Microsystem Technologies, Vol. 11, pp. 214-220.
  33. Y. Chiu, C.-H. Chen, J.-C. Chiou, W. Fang, and H.-P.D. Shieh, 2005, “MEMS-based Miniature Optical Pickup,” IEEE Trans. on Magnetics, Vol. 41, pp. 967-970.
  34. W. Chen, C. Lee, C.-Y. Wu, and W. Fang, 2005, “A New Latched 2x2 Optical Switch Using Bi-directional Movable Electrothermal H-beam Actuators,” Sensors and Actuators A, Vol. 123-124, pp. 563-569.
  35. C.-H. Lin, J.-M. Lu, and W. Fang, 2005, “Encapsulation of FBAR Filters Using Wafer-level Microcap Array,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 1433-1438.
  36. C.-H. Lin, H.-R. Chen, and W. Fang, 2005, “Design and Fabrication of a Miniaturized Bulk Acoustic Filter by High Aspect Ratio Etching Process,” Journal of Microlithography, Microfabrication and Microsystems, Vol.4.
  37. W. Fang, H.-Y. Chu, W.-K. Hsu, T.-W. Cheng, and N.-H. Tai, 2005, “Polymer reinforced aligned multi-walled carbon nanotube composites for MEMS applications,” Advanced Materials, Vol. 17, 2987-2992.
  38. H.-C. Chang, J. M.-L. Tsai, H.-C. Tsai, and W. Fang, 2005, “Design, Fabrication, and Testing of a 3-DOF HARM Micromanipulator on (111) Silicon Substrate,” Sensors and Actuators A, Vol. 125/2, pp. 438-445.
  39. Y.-C. Lin, H. Hocheng, W. Fang, and R.-S. Chen, 2005, “Fabrication and Fatigue Testing of an Electrostatically Driven Microcantilever Beam”, Materials and Manufacturing Processes.
  40. D.-H. Tsai, and W. Fang, 2005, “Design and Simulation of a Dual-axis Sensing Decoupled Vibratory Wheel Gyroscope,” Sensors and Actuators A, Vol. 126, pp.
  41. H.-A. Yang, C.-W. Lin, and W. Fang, 2005, “Wafer Level Self-Assembly of Microstructures Using the Global Magnetic Lifting and Localized Induction Welding,” Journal of Micromechanics and Microengineering, Vol. 16, pp. 27-32.
  42. M. Wu, and W. Fang, 2005, “The Molded Surface-micromachining and Bulk Etching Release (MOSBE) Fabrication Platform on (111) Si for MOEMS,” Journal of Micromechanics and Microengineering.
  43. W.-S. Su, S.-T. Lee, C.-Y. Lin, M.-S. Tsai, and W. Fang, 2005, “Tuning the Shape and Curvature of Micromachined Cantilever Using Multiple Plasma Chemistry Bonding Technology,” Sensors and Actuators A, (accepted).
  44. M. Wu, and W. Fang, 2005, “The Molded Surface-micromachining and Bulk Etching Release (MOSBE) Fabrication Platform on (111) Si for MOEMS,” Journal of Micromechanics and Microengineering.
  45. H.-A. Yang, C.-W. Lin, C.-Y. Peng, and W. Fang, 2006, “On the Selective Magnetic Induction Heating of Micron Scale Structures,” Journal of Micromechanics and Microengineering, Vol. 16, pp. 1314-1320 (corresponding author).
  46. M. Wu, S.-Y. Hsiao, C.-Y. Peng, and W. Fang, 2005, “Development of Tracking and Focusing Micro Actuators for Dual-stage Optical Pick-up Head,” J. of Optics A, Vol.8, pp. 323-329.
  47. W.-S. Su, S.-T. Lee, C.-Y. Lin, M.-S. Tsai, and W. Fang, 2005, “Tuning the Shape and Curvature of Micromachined Cantilever Using Multiple Plasma Chemistry Bonding Technology,” Sensors and Actuators A, (accepted).
  48. H.-Y. Chu, T.-Y. Kuo, B. Chang, S.-W. Lu, C.-C. Chiao, and W. Fang, 2005, “Design and Fabrication of Novel Three Dimensional Multi-electrode Array Using SOI Wafer,” Sensors and Actuators A, Vol 130-131, pp. 254-261.
  49. M. Wu, H.-Y. Lin, and W. Fang, 2006, “A Poly-Si Based Vertical Comb-drive Two-axis Gimbaled Scanner for Optical Applications,” IEEE Journal of Photonics Technology Letters, Vol 18, pp 2111-2113 (corresponding author).
  50. S.-Y. Lee, H.-W. Tung, W.-C. Chen, and W. Fang, 2006, “Thermal Actuated Solid Tunable Lens,” IEEE Journal of Photonics Technology Letters, Vol 18, pp 2191-2193. (corresponding author).
  51. W.-S. Su, S.-T. Lee, C.-Y. Lin, M.-C. Yip, M.-S. Tsai, and W. Fang, 2006, “Control the Shape of Buckling Micromachined Beam Using Plasma Chemistry Bonding Technology,” Japanese Journal of Applied Physics, Vol. 45, pp. 8479-8483 (corresponding author).
  52. Y.-C. Lee, S.-J. Lin, C.-Y. Lin, M.-C. Yip, W. Fang, and I.-N. Lin, 2006, “Pre-nucleation Techniques for Enhancing Nucleation Density and Adhesion of Low Temperature Deposited Ultra-nanocrystalline Diamond,” Diamond and Related Materials, Vol. 15, pp. 2046-2050.
  53. J.-H. Lee, S.-T. Lee, C.-M. Yao, and W. Fang, 2007, “Comments on the Size Effect of Microcantilever Quality Factor in Free Air Space,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 139-146 (corresponding author).
  54. W.-S. Su, M.-S. Tsai, and W. Fang, 2007, “A Three Dimensional Micro Fabrication Technology on Highly Structured Surfaces,” Electrochemical and Solid-State Letters, Vol. 10, pp. H16-H19 (corresponding author, also appeared in Virtual Journal of Nanoscale Science & Technology, 2006, 14, Issue 21).
  55. C. Wang, H.-H. Yu, M. Wu, and W. Fang, 2007, “Implementation of Phase-Locked Loop Control for MEMS Scanning Mirror Using DSP,” Sensors and Actuators A, Vol. 133, pp. 243-249 (corresponding author).
  56. H.-D. Cheng, S.-Y. Hsiao, M. Wu, and W. Fang, 2007, “Integrated Tracking and Focusing Systems of MEMS Optical Pickup Head,” IEEE Trans. on Magnetics, Vol. 43, pp. 805-807 (corresponding author).
  57. Y. Chiu, J.-C. Chiou, W. Fang, Y.-J. Lin, and M. Wu, 2007, “Design, Fabrication, and Control of Components in MEMS-Based Optical Pickups,” IEEE Trans. on Magnetics, Vol. 43, pp. 780-784.
  58. C.-W. Lin, H.-A. Yang, W. C. Wang, and W. Fang, 2007, “Implementation of three dimensional SOI-MEMS wafer level packaging using through-wafer interconnections,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1200-1205 (corresponding author).
  59. H.-C. Zeng, Y.-C. Ho, S.-T. Chen, H.-I. Wu, H.-W. Tung, W. Fang, and Y.-C. Chang, 2007, “Studying the formation of large cell aggregates in patterned neuronal cultures,” Journal of Neuroscience Methods, Vol. 165, pp. 72-82.
  60. C. Wang, M.-H. Tsai, C.-M. Sun, and W. Fang, 2007, “A novel CMOS out-of-plane accelerometer with fully-differential gap-closing capacitance sensing electrodes,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1275-1280 (corresponding author).
  61. J. Hsieh, S.-Y. Hsiao, C.-F. Lai, and W. Fang, 2007, “Integration of UV Curable Polymer Lens and MUMPs Structure on SOI Optical Bench,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1703-1709 (corresponding author).
  62. H.-A. Yang, T.-L. Tang, S.-T. Lee, and W. Fang, 2007, “A Novel Coil-less Scanning Mirror Using Eddy Current Lorentz Force and Magnetostatic Force,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 16, pp. 511-520 (corresponding author).
  63. C. Hsu, C. Tsou, and W. Fang, 2007, “Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter,” Journal of Microlithography, Microfabrication and Microsystems, Vol. 6, pp. 033011-1-033011-7.
  64. S.-Y. Lee, W.-C. Chen, H.-W. Tung, and W. Fang, 2007, “Microlens with Tunable Astigmatism,” IEEE Journal of Photonics Technology Letters, Vol. 19, pp. 1383-1385(corresponding author).
  65. M. Wu, H.-Y. Lin, and W. Fang, 2007, “Design of Novel Sequential Engagement Vertical Comb Electrodes for Analog Micro-mirror,” IEEE Journal of Photonics Technology Letters, Vol. 19, pp. 1586-1588 (corresponding author).




  1. S.-Y. Lee, W.-C. Chen, H.-W. Tung, and W. Fang, 2007, “Microlens with Tunable Astigmatism,” IEEE Journal of Photonics Technology Letters, Vol. 19, pp. 1383-1385(corresponding author).
  2. H.-L. Yin, Y.-C. Huang, W. Fang, and J. Hsieh, 2007, “A novel electromagnetic elastomer membrane actuator with a semi-embedded coil,” Sensors and Actuators A, Vol. 139, pp. 194-202.
  3. C.-M. Lin, W.-C. Chen, and W. Fang, 2007, “Removable Fast Package Technology for MEMS Devices Using Polymer Connectors and Silicon Sockets,” Journal of Micromechanics and Microengineering, (revised, corresponding author).
  4. C.-M. Sun, C.-W. Wang, and W. Fang, 2007, “On the Sensitivity Improvement of CMOS Capacitive Accelerometer,” Sensors and Actuators A, (revised, corresponding author).
  5. W.-K. Hsu, H.-Y. Chu, T.-H. Chen, T.-W. Cheng, and W. Fang, 2008, “Exceptional bimorph effect and low quality factor from carbon nanotube-polymer composites,” Nanotechnology, Vol. 19, pp. 1-4 (corresponding author).
  6. W.-C. Chen, P.-I. Yeh, C.-F. Hu, and W. Fang, 2008, “Design and Characterization of Single-layer Step-bridge Structure for Out-of-plane Thermal Actuator,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 17, pp. 70-77 (corresponding author).
  7. C.-W. Lin, C.-P. Hsu, H.-A. Yang, W. C. Wang, and W. Fang, 2008, “Implementation of SOG MEMS devices with embedded through-wafer silicon vias using glass reflow process for wafer-level packaging and 3D chip integration,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 025018, pp.1-7 (corresponding author).,
  8. L.-J. Chen, C.-C. Liu, N.-H. Tai, C.-Y. Lee, W. Fang, and I.-N. Lin, 2008, “Effects of tungsten metal coatings on enhancing the characteristics of ultrananocrystalline diamond films,” J. of Physical Chemistry C, Vol. 112, pp.3759-3765.
  9. B.-H. Jang, P.-H. Tseng, and W. Fang, 2008, “Characterization of Micro-Contact Properties Using a Novel Micromachined Apparatus,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 055020, pp.1-7 (corresponding author).
  10. C.-C. Wen, and W. Fang, 2008, “Tuning the Sensing Range and Sensitivity of 3 Axes Tactile Sensors Using the Polymer Composite Membrane,” Sensors and Actuators A, Vol. 145-146, pp.14-22 (corresponding author).
  11. W.-S. Su, H.-Y. Huang, and W. Fang, 2008, “Modification of the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications,” Japanese Journal of Applied Physics, Vol. 47, pp.5242-5247 (corresponding author).
  12. S.-Y. Hsiao, C.-C. Lee, and W. Fang, 2008, “Implementation of concave micro optical devices using polymer dispensing technique,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 085009, pp.1-7 (corresponding author).
  13. H.-Y. Chu, C.-M. Lin, and W. Fang, 2008, “The SOI DAWN Process for Three-dimensional Silicon Micromachining and Its Applications,” Sensors and Actuators A, Vol. 147, pp.656-664 (corresponding author).
  14. Y.-C. Lee, S.-J. Lin, V. Buck, R. Kunze, H. Schmidt, C.-Y. Lin, W. Fang, and I.-N. Lin, 2008, “Surface Acoustic Wave Properties of Natural Smooth Ultra-nanocrystalline Diamond Characterized by Laser-induced SAW Pulse Technique,” Diamond and Related Materials, Vol. 17, pp. 446-450.
  15. U.A., Palnitkar, P.T., Joseph, H. Niu, H.-Y. Huang, W. Fang, H.-F. Cheng, N.-H. Tai, and I.-N. Lin, 2008, “Adhesion Properties of Nitrogen Ion Implanted Ultra-nanocrystalline Diamond Films on Silicon Substrate,” Diamond and Related Materials, Vol. 17, pp. 864-867.
  16. C.-M. Lin, Y.-T. Lee, S.-R. Yeh, and W. Fang, 2009, “Flexible Carbon Nanotubes Electrode for Neural Recording,” Biosensors and Bioelectronics, Vol. 24, pp.2791-2797 (corresponding author).
  17. C.-W. Lin, Y.-T. Lee, C.-W. Chang, W.-L. Hsu, Y.-C. Chang, and W. Fang, 2009, “Novel Glass Microprobe Arrays for Neural Recording,” Biosensors and Bioelectronics, accepted (corresponding author).
  18. B.-H. Jang, H.-Y. Huang, and W. Fang, 2009, “A Novel Zero-insertion-force (ZIF) Micro(m)-connector: Design, Fabrication, and Measurements,” IEEE Transactions on Industrial Electronics, Vol. 56, pp.1040-1047. (corresponding author).
  19. U.A., Palnitkar, P.T., Joseph, H. Niu, H.-Y. Huang, W. Fang, H.-F. Cheng, N.-H. Tai, and I.-N. Lin, 2008, “Adhesion Properties of Nitrogen Ion Implanted Ultra-nanocrystalline Diamond Films on Silicon Substrate,” Diamond and Related Materials, Vol. 17, pp. 864-867.
  20. C.-M. Sun, C. Wang, M.-H. Tsai, H.-S. Hsieh, and W. Fang, 2009, “Monolithic Integration of Capacitive Sensors Using Double-side CMOS MEMS Post Process,” Journal of Micromechanics and Microengineering, Vol. 19, Art. No 015023, pp.1-9 (corresponding author).
  21. C.-P. Hsu, M.-C. Yip, and W. Fang, 2009, “Implementation of Gap-Closing Differential Capacitive Sensing Z-axis Accelerometer on SOI Wafer,” Journal of Micromechanics and Microengineering, Vol. 19, Art. No 075006, pp.1-7 (corresponding author).
  22. W.-S. Su, C.-M. Lin, T.-H. Chen, and W. Fang, 2009, “Patterning and Growth of Carbon Nanotubes on Highly Structured 3D Substrate Surface,” Journal of Micromechanics and Microengineering, accepted (corresponding author).
  23. M.-H. Tsai, C.-M. Sun, Y.-C. Liu, C. Wang, and W. Fang, 2009, “Design and Application of Metal Wet-etching Post Process for the Improvement of CMOS-MEMS Capacitive Sensors,” Journal of Micromechanics and Microengineering, accepted (corresponding author).
  24. C.-L. Wu, M.-C. Yip, and W. Fang, 2009, “Improvement of Specimen Preparation Process for Bulge Test Using the Combination of XeF2 and Deep Reactive Ion Etching,” Japanese Journal of Applied Physics, Vol.48., 06FK06 (corresponding author).
  25. Y. Chiu, H.-F. Shih, J.-C. Chiou, S.-T. Cheng, K.-Y. Hung, F.-G. Tseng, and W. Fang, 2009 “Design and Fabrication of a Small-Form-Factor Optical Pickup Head,” IEEE Trans. on Magnetics, Vol. 45, pp.2194-2197.
  26. C.-L. Wu, F.-L. Pan, C.-F. Tuan, S.-J. Chen, W. Fang, M.-C. Yip, 2009, “Measurement Uncertainty of Nano Bionix Universal Testing System,” Sensors and Materials, Vol. 20, pp.351-363.
  27. C.-L. Wu, H.-C. Lin, J.-S. Hsu, M.-C. Yip, and W. Fang, 2009, “Static and Dynamic Mechanical Properties of Polydimethylsiloxane/Carbon Nanotubes Nanocomposites,” Thin Solid Films, Vol. 517, pp.4895-4901.
  28. C.-M. Sun, M.-H. Tsai, Y.-C. Liu, and W. Fang, “Implementation of a Monolithic Single Proof-Mass Tri-Axis Accelerometer Using CMOS-MEMS Technique,” IEEE Transactions on Electron Devices, Vol. 57, issue 7, pp. 1670-1679, 2010.(Corresponding author).
  29. Y.-T. Lee, C.-W. Lin, C.-M. Lin, S.-R. Yeh, Y.-C. Chang, and W. Fang, 2010, “A Pseudo-3D Glass Microprobe Array: Glass Microprobe with Embedded Silicon for Alignment and Electrical Interconnection during Assembly,” Journal of Micromechanics and Microengineering, Vol. 20, Art. No 025014, pp.1-9 (corresponding author).
  30. T.-L. Tang, C.-P. Hsu, W.-C. Chen, and W. Fang, 2010, “Design and Implementation of Torque-Enhancement 2-axis Magnetostatic SOI Optical Scanner,” Journal of Micromechanics and Microengineering, Vol. 20, Art. No 025020, pp.1-8 (corresponding author).
  31. C.-T Hong, T.-T Tang, C.-Y Hung, R.-P Pan, and W. Fang, “Liquid crystal alignment in nanoporous anodic aluminum oxide layer for LCD panel applications," Nanotechnology, Vol. 21, pp. 1-10 (corresponding author).
  32. C.-C. Lee, S.-Y. Hsiao, and W. Fang, 2010, “Implementation of a micro ball lens on a silicon optical bench using insoluble two-phase liquid immersion technology,” Journal of Micromechanics and Microengineering, Vol. 20, Art. No 085015, pp.1-7 (corresponding author).
  33. H.-Y. Huang, H.-T. Hsu, H.-Y. Lin, Y. Chiu, and W. Fang, 2010, “A photovoltaic pn junction micro vertical comb-drive actuator,” Journal of Micromechanics and Microengineering, Vol. 20, Art. No 105014, pp.1-8 (corresponding author).
  34. Y.-C. Huang, B.-H. Jang, and W. Fang, 2010, “Lifting, Welding, and Packaging of a Quality-Factor-Controllable Micromachined Inductor Using Magnetic Fields,” Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), Vol. 9, Art. No 043008, pp.1-6 (corresponding author).
  35. H.-I. Wu, G.-H. Cheng, Y.-Y. Wong, C.-M. Lin, W. Fang, W.-Y. Chow, and Y.-C. Chang, 2010, “A lab-on-a-chip platform for studying the subcellular functional proteome of neuronal axons,” Lab on a Chip, Vol. 10, pp.647-653.
  36. T.-W. Cheng, C.-L. Lu, Y.-C. Lai, H.-F. Kuo, W. Fang, N.-H. Tai, and W.-K. Hsu, 2010, “Oscillation induced a worm-like locomotion of carbon nanotubes,” Physcial Chemistry Chemical Physics, Vol. 12, pp.8810-8814.
  37. H.-C. Su, C.-M. Lin, S.-J. Yen, Y.-C. Chen, C.-H. Chen, S.-R. Yeh, W. Fang, H. Chen, D.-J. Yao, Y.-C. Chang, T.-R. Yew, 2010, “A Cone-shaped 3D Carbon Nanotube Probe for Neural Recording,” Biosensors and Bioelectronics, Vol. 26, pp.220-227.
  38. Y. Jhong, D. Mikolas, T. Yeh, W. Fang, D. Shaw, J. Chen, and C. Fu, 2010, “Characterization of nonlinear effects in a two-dimensional dielectric elastomer actuator,” Smart Materials and Structures, Vol. 19, Art. No 105027, pp.1-6.
  39. Y.-C. Liu, C.-M. Sun, L.-Y. Lin, M.-H. Tsai, and W. Fang, 2011, “Development of a CMOS-based Tactile Sensor with Adjustable Sensing Range and Sensitivity Using Capacitive Polymer Fill-in,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 20, pp.119-127 (corresponding author).
  40. J.-H. Lee, Y.-D. Lau, C.-H. Yao, and W. Fang, 2011, “Experimental Study of the Effect of Hydrodynamic Coupling of Microcantilever Array on the Dynamic Response of Microcantilever,” Sensors and Actuators A, Vol. 165, pp.79-85 (corresponding author).
  41. Y.-T. Lee, Y.-C. Chang, and W. Fang, 2011, “Integration of Silicon-via Electrodes with Different Recording Characteristics on Glass Microprobe through Glass Reflowing Process,” Biosensors and Bioelectronics, Vol. 26, pp.4739-4746 (corresponding author).
  42. T.-L. Tang, and W. Fang, 2011, “Magnetostatic Torsional Actuator with Embedded Nickel Structures for the Improvement of Driving Force and Wobble Motion,” Journal of Micromechanics and Microengineering, Vol. 21, Art. No 095007, pp.1-8. (corresponding author, special collection in the IoP Select http://Select.iop.org ).
  43. Y.-C. Liu, M.-H. Tsai, T.-L. Tang, and W. Fang, 2011, “Post-CMOS Selective Electroplating Technique for the Improvement of CMOS-MEMS Accelerometers,” Journal of Micromechanics and Microengineering, Vol. 21, Art. No 105005, pp.1-9. (corresponding author).
  44. H.-S. Hsieh, H.-C. Chang, C.-F. Hu, C.-L. Cheng, and W. Fang, 2011, “A Novel Stress Isolation Guard-Ring Design for the Improvement of Three-axis Piezoresistive Accelerometer,” Journal of Micromechanics and Microengineering, Vol. 21, Art. No 105006, pp.1-11. (corresponding author).
  45. C.-F. Hu, W.-S. Su, and W. Fang, 2011, “Development of Patterned Carbon Nanotubes on 3D Polymer Substrate for the Flexible Tactile Sensor Application,” Journal of Micromechanics and Microengineering, Vol. 21, Art. No 115012, pp.1-12 (corresponding author).
  46. C.-H. Huang, C.-H. Lee, T.-M. Hsieh, L.-C. Tsao, S. Wu, J.-C. Liao, M.-I. Wang, L.-C. Chen, M.-C. Yip, and W. Fang, 2011, “Implementation of the CMOS MEMS condenser microphone with corrugated metal diaphragm and silicon back-plate,” Sensors, Vol. 11, pp.6257-6269 (corresponding author).
  47. C.-K. Chan, W.-C. Lai, M. Wu, M.-Y. Wang, and W. Fang, 2011, “Design and Implementation of a Capacitive-type Microphone with Rigid Diaphragm and Flexible Spring Using the Two Poly Silicon Micromachining Processes,” IEEE Sensors Journal, Vol. 11, pp.2365-2371 (corresponding author).
  48. C. Hong, W.-C. Lai, L. Chu, A.-S. Chiang, and W. Fang, 2011, “Implementation of a New Capacitive Touch Sensor Using the Nanoporous Anodic Aluminum Oxide (np-AAO) Structure,” IEEE Sensors Journal, Vol. 11, pp.3409-3416 (corresponding author).
  49. W.-C. Chen, W. Fang, and S.-S. Li, 2011, “A Generalized CMOS-MEMS Platform for Micromechanical Resonators Monolithically Integrated with Circuits,” Journal of Micromechanics and Microengineering, Vol. 21, Art. No 065012, pp.1-7.
  50. C.-C. Lin, W. Fang, H.-Y. Lin, C.-H. Hsueh, and S. Lee, 2011, “Measurements of Residual Stresses in Al Film/Silicon Nitride Substrate Microcantilever Beam Systems,” Journal of Materials Research, Vol. 26, pp.1279-1284.
  51. T.-T. Tang, C.-Y. Hung, R.-P. Pan, C. Hong, and W. Fang, 2011, “Vertical Alignment of Liquid Crystal on ITO Glass with Anodic Aluminum Oxide Thin Film,” Molecular Crystals and Liquid Crystals, Vol. 543, pp.160-168.
  52. W.-C. Chen, M.-H. Li, Y.-C. Liu, W. Fang, and S.-S. Li, 2012, “A Fully Differential CMOS-MEMS DETF Oxide Resonator with Q > 4800 and Positive TCF,” IEEE Electron Device Letters, Vol. 33, pp.721-723.
  53. C.-M. Sun, C.-L. Wu, C. Wang, C.-I. Chang, M.-C. Yip, and W. Fang, 2012, “Implementation of Complementary Metal–Oxide–Semiconductor Microelectromechanical Systems Lorentz Force Two Axis Angular Actuator,” Japanese Journal of Applied Physics, Vol. 48., 06FL09 (corresponding author).
  54. M.-H. Tsai, Y.-C. Liu, and W. Fang, 2012, “A 3-axis CMOS-MEMS Accelerometer Structure with Vertically Integrated Fully-Differential Sensing Electrodes,” IEEE/ASME Journal of Microelectromechanical Systems, (accepted, corresponding author).
  55. W.-C. Chen, W. Fang, and S.-S. Li, 2012, “High-Q Integrated CMOS-MEMS Resonators With Deep-Submicrometer Gaps and Quasi-Linear Frequency Tuning,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 21, pp.688-701.
  56. C.-Y. Chen, K.-Y. Cheng, Y.-C. Chu, L.-J. Chen, W. Fang, C.-S. Chang, and L.-J. Chou, 2012, “Liquid-Solid Process for Growing Gold Nanowires on an Indium Tin Oxide Substrate as Excellent Field Emitters,” J. of Physical Chemistry C, Vol. 116, pp.12824-12828.




  1. J.-H. Wen, and W. Fang, 2012, “Microdevice Array Design and Fabrication in Monolithic MEMS SoC,” Micro & Nano Letters, Vol. 7, pp.709-712, (student as first/corresponding author).
  2. W.-C. Chen, M.-H. Li, Y.-C. Liu, W. Fang, and S.-S. Li, 2012, “A Fully Differential CMOS-MEMS DETF Oxide Resonator with Q > 4800 and Positive TCF,” IEEE Electron Device Letters, Vol. 33, pp.721-723.
  3. W.-C. Chen, W. Fang, and S.-S. Li, 2012, “High-Q Integrated CMOS-MEMS Resonators With Deep-Submicrometer Gaps and Quasi-Linear Frequency Tuning,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 21, pp.688-701.
  4. C.-Y. Chen, K.-Y. Cheng, Y.-C. Chu, L.-J. Chen, W. Fang, C.-S. Chang, and L.-J. Chou, 2012, “Liquid-Solid Process for Growing Gold Nanowires on an Indium Tin Oxide Substrate as Excellent Field Emitters,” J. of Physical Chemistry C, Vol. 116, pp.12824-12828.
  5. Y.-C. Liu, M.-H. Tsai, W.-C. Chen, M.-H. Li, S.-S. Li, and W. Fang, 2013, “Temperature-Compensated CMOS-MEMS Oxide Resonators,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 22, pp.1054-1065. (corresponding author).
  6. P.-H. Lo, S.-H. Tseng, J.-H. Yeh, and W. Fang, 2013, “Development of a Proximity Sensor with Vertically Monolithic Integrated Inductive and Capacitive Sensing Units,” Journal of Micromechanics and Microengineering, Vol. 23, Art. No 035013, pp.1-9, (corresponding author).
  7. C.-L. Chang Chien, Y.-C. Huang, S.-F. Hu, C.-M. Chang, M.-C. Yip, and W. Fang, 2013, “Polymer Dispensing and Embossing Technology for the Lens Type LED Packaging,” Journal of Micromechanics and Microengineering, Vol. 23, Art. No 065019, pp.1-10, (corresponding author).
  8. C.-F. Hu, J.-Y. Wang, Y.-C. Liu, M.-H. Tsai, and W. Fang, 2013, “Development of 3D Carbon Nanotubes Interdigitated Finger Electrodes on Polymer Substrate for Flexible Capacitive Sensor Application,” Nanotechnology, Vol. 24, Art. No 444006, pp.1-14 (corresponding author).
  9. C.-I. Chang, M.-H. Tsai, Y.-C. Liu, C.-M. Sun, and W. Fang, 2013, “Pick-and-Place Process for Sensitivity Improvement of the Capacitive Type CMOS MEMS 2-axis Tilt Sensor,” Journal of Micromechanics and Microengineering, Vol. 23, Art. No 095029, pp.1-9 (corresponding author).
  10. M. Narducci, Y.-C. Liu, W. Fang, and J. Tsai, 2013, “CMOS MEMS capacitive absolute pressure sensor,” Journal of Micromechanics and Microengineering, Vol. 23, Art. No 055007, pp.1-5 (international collaboration with A*Star, Singapore).
  11. J.-S. Peng, W. Fang, H.-Y. Lin, C.-H. Hsueh, and S. Lee, 2013, “Measurements of residual stresses in the Parylene C film/silicon substrate using a microcantilever beam,” Journal of Micromechanics and Microengineering, Vol. 23, Art. No 095001, pp.1-7.
  12. H. Wang, Z. Xiang, C.-F. Hu, A. Pant, W. Fang, S. Alonso, G. Pastorin, and C. Lee, 2013, “Development of stretchable membrane based nanofilters using patterned arrays of vertically grown carbon nanotubes,” Nanoscale, DOI: 10.1039/c3nr02742b, (international collaboration with National U. of Singapore, Singapore).
  13. Y.-H. Lin, H.-J. Tsai, H.-C. Chang, W.-Y. Lin, W. Fang, and W.-K. Hsu 2013, “Carbon nanotube alignment driven rapid actuations,” Nanotechnology, Vol. 24, Art. No 465501, pp.1-6.
  14. C.-I. Chang, M.-H. Tsai, C.-M. Sun, and W. Fang, 2014, “Development of CMOS MEMS In-plane Magnetic Coils for the Applications of 3-axis Resonant Magnetic Sensor,” Journal of Micromechanics and Microengineering, Vol. 24, Art. No 035016, pp.1-14. (corresponding author).
  15. F.-M. Hsu, and W. Fang, 2014, “Development of Two-Stage Solidification Technology to Implement Micro Structures with Liquid Magnetic Polymer and Solid Magnetic Anisotropic Polymer,” Journal of Micromechanics and Microengineering, Vol. 24, Art. No 095024, pp.1-12. (corresponding author).
  16. C.-T. Chiang, C.-I. Chang, and W. Fang, 2014, “Design of a Digitized Vibration Detector Implemented by CMOS Digitized Capacitive Transducer with In-plane SOI Accelerometer,” IEEE Sensors Journal, Vol. 14, pp.2546-2556.
  17. 1H. Wang, Z. Xiang, C.-F. Hu, G. Pastorin, W. Fang, and C. Lee, 2014, “Microneedle Array Integrated with CNT Nanofilters for Controlled and Selective Drug Delivery,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 23, pp.1036-1044 (international collaboration with National U. of Singapore, Singapore).
  18. P.-H. Lo, G.-L. Luo, C.-C. Lee, and W. Fang, 2015, “The nanoporous anodic aluminum oxide as a promising material for the electrostatically controlled thin film interference filter,” Journal of Micromechanics and Microengineering, Vol. 25, Art. No 025001, pp.1-12. (corresponding author).
  19. C.-L. Cheng, M.-H. Tsai, and W. Fang, 2015, “Determining the Thermal Expansion Coefficient of Thin Films for CMOS MEMS Process Using the Test Cantilevers,” Journal of Micromechanics and Microengineering, Vol. 25, Art. No 025014, pp.1-14. (corresponding author).
  20. V. P. J. Chung, M.-C. Yip, and W. Fang, 2015, “Resorcinol-Formaldehyde Aerogels for CMOS-MEMS Capacitive Humidity Sensor,” Sensors and Actuators B, Vol. 214, pp.181-188. (corresponding author).
  21. F.-Y. Lee, X. Zhou, X. Yang, W. Fang, and S.-C. Chen, 2015, “Design of a Tunable Resonant Micromirror,” Sensors and Actuators A, Vol. 234, pp.72-81. (co-corresponding author).
  22. C.-L. Cheng, H.-C. Chang, C.-I. Chang, and W. Fang, 2015, “Development of CMOS MEMS Pressure Sensor using Mechanical Force-displacement Transduction Structure,” Journal of Micromechanics and Microengineering, Vol. 25, Art. No 125024, pp.1-12. (corresponding author).
  23. S. Wang, W.-C. Chen, B. Bahr, W. Fang, S.-S. Li, and D. Weinstein, 2015, “Temperature Coefficient of Frequency Modeling for CMOS-MEMS Bulk Mode Composite Resonators,” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Vol. 62, pp. 1166-1178. (co-author; international collaboration with MIT, USA).
  24. M.-H. Tsai, Y.-C. Liu, K.-C. Liang, and W. Fang, 2015, “Monolithic CMOS-MEMS Pure Oxide Tri-axis Accelerometers for Temperature Stabilization and Performance Enhancement,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 24, 1916-1927. (corresponding author).
  25. W.-L. Hsu, H.-W. Chung, C.-Y. Wu, H.-I. Wu, Y.-T. Lee, E.-C. Chen, W. Fang, and Y.-C. Chang, 2015, “Glutamate Stimulates Local Protein Synthesis in the Axons of Rat Cortical Neurons by Activating _-Amino-3-hydroxy-5-methyl-4-isoxazolepropionic Acid (AMPA) Receptors and Metabotropic Glutamate Receptors,” the Journal of Biological Chemistry, (accepted, co-author).
  26. W.-L. Sung, C.-C. Chen, K. Huang, and W. Fang, 2016, “Development of Large-Area Chip-Network with Multi Devices Integration Using Stretchable Electroplated Copper Spring,” Journal of Micromechanics and Microengineering, Vol. 26, Art. No 025003, pp.1-15. (corresponding author, highlighted as the cover page).
  27. H.-C. Chang, S.-C. Liao, H.-S. Hsieh, J.-H. Wen, C.-H. Lai, and W. Fang, 2016, “Magnetostrictive Type Inductive Sensing Pressure Sensor,” Sensors and Actuators A, Vol. 238, pp.25-36. (corresponding author).
  28. C-W Cheng, K-C Liang, C-H Chu and W Fang, 2017, “Implementation of various vacuum conditions in sealed chambers for wafer-level bonding by using embedded cavity, ” Journal of Micromechanics and Microengineering, Vol. 27, Art. No 015002 (11pp).
  29. S.-W. Cheng, J.-C. Weng, K.-C. Liang, Y.-C. Sun and W. Fang, 2018, “Realize multiple hermetic chamber pressures for system-on-chip process by using the capping wafer with diverse cavity depths,” Journal of Micromechanics and Microengineering, Vol. 28, Art. No 045005 (9pp).
  30. S.-K. Yeh, H.-C. Chang, and W. Fang, 2018, “Development of CMOS MEMS inductive type tactile sensor with the integration of chrome steel ball force interface,” Journal of Micromechanics and Microengineering, Vol. 28, Art. No 0044005 (11pp).
  31. T-W. Shen, K.-C. Chang, C.-M. Sun and W. Fang, 2019, “Performance enhance of CMOS-MEMS thermoelectric infrared sensor by using sensing material and structure design,” Journal of Micromechanics and Microengineering, Vol. 29, Jan. No 025007 (15pp).
  32. S.-K. Yeh and W. Fang, 2019, “Inductive Micro Tri-Axial Tactile Sensor Using a CMOS Chip with a Coil Array,” IEEE Electron Device Letters, DOI: 10.1109/LED.2019.2901946, (4pp).
  33. Shih wei Lin and W. Fang, 2019, “Usage of the impedance effect of a spiral dual-coil for finger print sensor application,” Sensors and Actuators A,Physical SNA-111740;No.of Pages12
  34. S.-K. Yeh and W. Fang, 2019, “ On the Detection Interfaces for Inductive Type Tactile Sensors,”DOI: 10.1016/j.sna.2019.111545
  35. S.-K. Yeh, J.-H. Lee, and W. Fang, “Development of the backside loading inductive tactile force sensor using the flip-chip bonding of CMOS sensing chip,” IEEE Sensors Journal, vol. 20, pp. 2868-2876, 2020.
  36. H.-H. Cheng, S.-C. Lo, Z.-R. Huang, Y.-J. Wang, M. Wu, and W. Fang, “On the design of piezoelectric MEMS microspeaker for the sound pressure level enhancement,” Sensors and Actuators A: Physical, vol. 306, no. 1, pp. 111960 (17), 2020.
  37. A. Vergara, T. Tsukamoto1, W. Fang, and S. Tanaka, “Integration of buried piezoresistive sensors and PZT thin film for dynamic and static position sensing of MEMS actuator,” Journal of Micromechanics and Microengineering, vol. 30, no. 11, pp. 115020 (8), 2020..
  38. B.-C. You, S.-C. Lo, C.-K. Chan, C.-S. Li, H.-L. Ho, S.-C. Chiu, G.-H. Hsieh, and W. Fang, “Design and implementation of dual pressure variation chambers for bone conduction microphone,” Journal of Micromechanics and Microengineering, vol. 30, no. 12, pp. 125009 (19), 2020.
  39. P.-S. Lin, T.-W. Shen, K.-C. Chan, and W. Fang, “CMOS MEMS thermoelectric infrared sensor with plasmonic metamaterial absorber for selective wavelength absorption and responsivity enhancement,” IEEE Sensors Journal, vol. 20, no. 19, pp. 11105-11114, 2020.
  40. M.-L. Hsieh, S.-K. Yeh, J.-H. Lee, M.-C. Cheng, and W. Fang, “CMOS-MEMS capacitive tactile sensor with vertically integrated sensing electrode array for sensitivity enhancement,” Sensors and Actuators A: Physical, vol. 317, no. 1, pp. 112350 (13), 2021.
  41. C. Liou, F. Shih, Y. Huang, Z. Hu, C. Tsou, and W. Fang, “The implementation of sapphire microreflector for monolithic micro-LED array,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 2, pp. 181-190, 2021.
  42. W.-C. Lai, M.-L. Hsieh, and W. Fang, “Electric modulation on the sensitivity and sensing range of CMOS-MEMS tactile sensor by using the PDMS elastomer fill-In,” IEEE Sensors Journal, vol. 21, no. 5, pp. 5828-5835, 2021.
  43. A. Kikias, Y.-T Lee, U.-P. Froriep, D. Moser, T. Holzhammer, U. Egert, W. Fang, O. Paul, P. Ruther, "Intracortical probe arrays with silicon backbone and microelectrodes on thin polyimide wings enable long-term stable recordings in vivo," bioRxiv 2021.04.30.442146; doi: https://doi.org/10.1101/2021.04.30.442146
  44. S. -K. Yeh, M. -L. Hsieh and W. Fang, "CMOS-Based Tactile Force Sensor: A Review," in IEEE Sensors Journal, vol. 21, no. 11, pp. 12563-12577, 1 June1, 2021, doi: 10.1109/JSEN.2021.3060539.
  45. W.Fang, S.-S. Li, Y. Chiu, M.-H. Li, "MEMS Using CMOS Wafer," 3D and Circuit Integration of MEMS, 2021
  46. Y.-C. Lee, M.-L. Hsieh, P.-S. Lin, C.-H. Yan, S.-K. Yeh, T.-T. Do, W. Fang, "CMOS-MEMS technologies for the applications of environment sensors and environment sensing hubs," 2021 J. Micromech. Microeng. 31 074004
  47. Y.-C. Chen, S.-C. Lo, Y.-J. Wang, M. Wu, W. Fang, "On the PZT/Si unimorph cantilever design for the signal-to-noise ratio enhancement of piezoelectric MEMS microphone," 2021 J. Micromech. Microeng. 31 105003
  48. C. Liou, F. Shih, Y. Huang, Z. Hu, C. Tsou, and W. Fang, 2021, “The Implementation of Sapphire Micro-reflector for Monolithic Micro-LED Array,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, pp.181-190 (co-author)
  49. A. Vergara, T. Tsukamoto, W. Fang, and S. Tanaka, 2021, “Feedback Control of Thin Film PZT MEMS Actuator with Integrated Buried Piezoresistors,” Sensors and Actuators A, Vol. 332, Art. No 113131, pp.1-6 (co-author).
  50. F. Shih, C. Tsou, and W. Fang, 2021, “A Monolithic Micromachined Thermocouple Probe with Electroplating Nickel for Micro-LED Inspection,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 11, pp.181-190 (co-author).
  51. A. Kilias, Y-T Lee, U. P. Froriep, C. Sielaff, D. Moser, T. Holzhammer, U. Egert, W. Fang, O. Paul, and P. Ruther, 2021, “Intracortical probe arrays with silicon backbone and microelectrodes on thin polyimide wings enable long-term stable recordings in vivo,” Journal of Neural Engineering, Vol. 18, Art. No 066026, pp.1-10 (co-author).
  52. K-C. Liang, W. Fang, 2019, “Design and implementation of monolithically integrated sealed and unsealed chambers by using the wafer level packaging,” Journal of Micromechanics Microengineering, Vol. 29, Art. No 095008.
  53. H.-C. Cheng, S.-C. Liu, C.-C. Hsu, H.-Y. Lin, F.i Shih, M. Wu, K.-C. Liang, M.-F. Lai, and W. Fang, 2023, “On the design of piezoelectric MEMS scanning mirror for large reflection area and wide scan angle,” Sensors and Actuators A, Vol. 349, Art. No 114010, pp.1-19
  54. S.-C. Liu, H.-C. Cheng, S.-H. Chen, H.-Y. Lin, C.-C. Hsu, F. Shih, K.-C. Liang, M. Wu, W. Fang, “On the Design of Piezoelectric actuator for 1D MEMS scanning mirror applications,” Journal of Micromechanics and Microengineering, Vol. 33, No. 034002, pp.1-20
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