Yung-Dong Lau

    Journal＆Conference

  • 張佐吉、朱懷遠、Yuen-Tung Liu、方維倫, 2005, 晶片級微測試儀器之開發及其於薄膜材料機械性質量測之應用, 第九屆奈米工程暨微系統技術研討會, 南台科技大學, 台南市.
  • Y.-D. Lau, T.-C. Chang, H. Hocheng, R. Chen, and W. Fang, 2007, “A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique,” MRS Fall Meeting 2007, Boston, MA, USA.
  • Yuen-Tung Liu、張佐吉、賀陳弘、陳榮順、方維倫, 2007, 新型晶片級微拉伸測試儀之研究及其於薄膜材料機械性質量測之應用,中國機械工程學會第二十四屆全國學術研討會，中原大學，桃園縣.
  • Y.-D. Lau, T.-C. Chang, H. Hocheng, R. Chen, and W. Fang, 2008, “A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen of Aluminum by Parylene Passivation Technique,” SNDT 2008, Hsinchu, Taiwan.
  • Y.-D. Lau, C.-P. Hsu, H. Hocheng, R. Chen, and W. Fang, 2008, “A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen of Gold by Parylene Passivation Technique,” the APCOT 2008 Conference, Tainan, Taiwan.
  • C.-P. Hsu, Y.-D. Lau, D.-H Tsai, M.-C. Yip, and W. Fang, 2008, “Decoupled Z-axis Microgyroscope Using Oblique Comb for Frequency Tuning,” the APCOT 2008 Conference, Tainan, Taiwan.
  • Y.-D. Lau, H. Hocheng, R. Chen, and W. Fang, 2008, “A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen of Gold and Aluminum by Parylene Passivation Technique,” ASME 2008, Brooklyn, NY, USA.
  • J.-H. Lee, Y.-D. Lau, C.-M. Yao, and W. Fang, 2009, “Tuning the Quality Factor of Microcantilever Using Hydrodynamic Coupling of Micro Structures,” Transducers’09, Denver, CO.
  • Chun-Hung Li、Yuen-Tung Liu、姚志民、方維倫, 2009, 主動式微懸臂樑陣列液動耦合之研究與應用, 第13屆奈米工程暨微系統技術研討會, 交通大學, 新竹市.
  • Autobiography

    • Yung-Dong Lau received the B.S. degree in Mechanical Engineering from National Pingtung University of Science and Technology in 2002 and M.S. degree in Mechanical and Computer Aided Engineering from Feng Chia University in 2005. He is also a Ph.D. student in Power Mechanical Engineering at National Tsing Hua University since 2005. His research has focused on the development of experimental techniques for measuring mechanical properties of MEMS materials and other micro-specimens.