張簡千琳

  • 現職：
  • 學歷：清大動機所
  • 經歷：Led Package
  • 研究方向：Led Package
  • 興趣嗜好：旅遊
  • beed123@hotmail.com
  • Journal paper
  • C. L. Chang-Chien, Y. C. Huang, M. C. Yip, and W. Fang, “‘Flip glass substrate’ package technology for LED yield and performance enhancement”, J. Micromech. Microeng., 22, 105039, 2012.
  • C. L. Chang Chien, Y. C. Huang, S. H. Hu, Z. H. Yang, C. M. Chang , M. C. Yip, and W. Fang, “Polymer Dispensing and Embossing Technology for the Lens Type LED Packaging”, J. Micromech. Microeng., 23, 065019, 2013.
  • 專題報導
  • "New LED packaging technology improves performance." September 25th, 2012. http://phys.org/news/2012-09-packaging-technology.html(專題報導)

    Conference paper

  • C.-L. Chang-Chien, Y.-C. Huang, M.-C. Yip, and W. Fang, “Development of a “flip glass substrate” LED package technology for color bin yield and view angle enhancement,” The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducer 2011), Beijing, China, June 5-9, 2011.
  • C.-L. Chang-Chien, Y.-Che Huang, M.-C. Yip, and W. Fang, 2011, “ ‘Flip Glass Substrate’ LED Package Technology For Color Bin Control And Wide View Angle,” 第15屆奈米工程暨微系統技術研討會, 台北科技大學, 台北市.
  • C.-L. Chang-Chien, Y.-C. Huang, M.-C. Yip, and W. Fang, “Designs on flip-glass of LED package for selective enhancement of emitting-intensity and view-angle,” The 25th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2012), Paris, France, Jan. 29 –Feb. 2, 2012.
  • C.-L. Chang-Chien, Y.-C. Huang, M.-C. Yip, and W. Fang, “Selectively enhance the emitting-intensity and view-angle by surface modification for flip-glass of LED package,” 2012 Symposium on Nano Device Technology (2012SNDT), Hsinchu, Taiwan, Apr. 26-27, 2012. (優等獎)
  • C. L. Chang Chien, Y.C. Huang, C. M. Chang, S. F. Hu, C. W. Sun, M.C. Yip, Weileun Fang , “LED package with Dome/side-emitting-enhancement silicone lens achieved by dispensing and geometry transferring”, Proc. SPIE 8484, Twelfth International Conference on Solid State Lighting and Fourth International Conference on White LEDs and Solid State Lighting, 84841B, San Diego, Aug. 12-16, 2012.
  • H. F. Hu, C. L. Chang Chien , Z. H. Yang, C. M. Chang, C. P. Hsu, Ming-Chuen Yip, and Weileun Fang , “The study of angular color temperature variation for various package structures of white LED package”, ICEP 2013, Japan.
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