楊學安

  • 現職：OPUS
  • 博士畢業論文：
    電磁感應渦電流於微機電系統之分析與應用

    Conference

  • [1] Hsueh-An Yang, Na Chen, Yu-Ching Lin, Deng Pan, Thomas Gessnsr, Dmitri V. Louzguine-Luzgin, Akihisa Inoue, and Masayushi Esashi, 2010, “Micro molding using Bulk Metallic Glasses material,” The 2010 WPI-AIMR Annual Workshop, Japan. (Poster)
  • [2] Hsueh-An Yang, N. Chen, Yu-Ching Lin, Thomas Gessner, D.V. Louzguine-Luzgin, A. Inoue, and Masayoshi Esashi, 2010, “A study of micro moulding using metallic glass material,” The 5th APCOT international conference, Western Australia. (Oral)
  • [3] Chen-Chao Wang, Hsueh-An Yang, Ying-Chieh Shyu, Meng-Hsun Li, Chi-Tsung Chiu, Sung-Mao Wu, Chih-Wen Kuo, and Chih-Pin Hung, 2008, “Analysis of high performance RF integrated passive circuits using the glass substrate,” IEEE VLSI Packaging Workshop, Japan. (Oral)
  • [4] Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang, Wei Chung Wang, and Weileun Fang, 2008, “ Implementation of SOG devices with embedded through-wafer silicon vias using a glass reflow process for wafer-level 3D MEMS integration,” IEEE MEMS International Conference, Tucson, AZ, U.S.A (Poster)
  • [5] Hsueh-An Yang, Chen-Chao Wang, Po-Jen Zheng, and Wei-Chung Wang, 2007, “On-chip high-Q inductor using wafer-level chip-scale package technology,” Microsystems, Packaging, Assembly and Circuits Technology, IMPACT. International, Taipei. (Oral)
  • [6] Tsung-Lin Tang, Hsueh-An Yang, Han-Tang Su, and Weileun Fang, 2007, “A Magnetic Repulsive Force MEMS Actuator,” International Conference on Solid-State Sensors and Actuators -Transducer’07. Lyon, France. (poster)
  • [7] Chia-Min Lin, Wen-Chih Chen, Hsueh-An Yang, and Weileun Fang, 2007, “Removable Fast Packing of MEMS Devices Using Polymer Connectors and Silicon Sockets,” IEEE MEMS International Conference, Kobe, Japan. (poster)
  • [8] Hsueh-An Yang, and Weileun Fang, 2006, “A Novel Coil-less Lorentz Force 2D Scanning Mirror Using Eddy Current,” IEEE MEMS International Conference, Istanbul, Turkey. (poster)
  • [9] Hsueh-An Yang, and Weileun Fang, 2005, “On the scale effect of magnetic induction heating for microstructure,” International Conference on Solid-State Sensors and Actuators -Transducer’05. Seoul, Korea. (oral)
  • 學歷：
  • 國立清華大學動力機械系博士班 (2002.9~2006.1)
  • 國立台北科技大學製造科技研究所碩士班 (2000.9~2002.7)
  • 經歷：
  • 日月光半導體主任工程師 (2005.7~2007.2)
  • 日月光半導體部副理 (2007.2~2009.6)
  • 國立中山大學電機系兼任助理教授 (2007.2~2007.7)
  • 日本東北大學機械系研究員 (2009.8~2010.4)
  • 台灣積體電路製造股份有限公司技術經理 (2010.5~2011.8)
  • 先進微系統總經理特別助理 (2011.9~2012.2)
  • 加州大學柏克萊分校機械系研究員 (2012.3~ )
  • 技術專長：
  • TFT-LCD, and CNT FED manufacturing
  • MEMS fabrication and package
  • 3D IC (TSV, wafer thinning, wafer bumping, and stack die)
  • On wafer RF passive devices (IPD, and high Q inductor)
  • 榮譽：
  • 奈米元件技術研討會, 2003, 學生論文優等獎
  • 國立清華大學工學院論文發表競賽, 2004, 口頭報告組第一名
  • 中國機械工程學會, 2006, 博士論文獎佳作
  • Journal papers：
  • N. Chen, Hsueh-An Yang, A. Caron, P. C. Chen, Y. C. Lin, D.V. Louzguine-Luzgin, K. F. Yao, M. Esashi, and A. Inoue, 2010, “Glass-forming ability and thermoplastic formability of a Pd40Ni40Si4P16 glassy alloy,” Journal of Materials Science, Vol.46, pp.2091-2096 (Cited: 2)
  • Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang, Wei Chung Wang and Weileun Fang, 2008, “Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 025018, pp. 1-7 (Cited: 13)
  • Chiung-Wen Lin, Hsueh-An Yang, Wei Chung Wang and Weileun Fang, 2007, “Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1200-1205 (Cited: 26)
  • E-Mail：
  • d917706@alumni.nthu.edu.tw