徐家保

  • 現職：台積電
  • 公司網頁：www.tsmc.com
  • 博士畢業論文：
    以SOI晶片實現微型三軸加速度計

    Journal＆Conference

  • 1. Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang, Wei Chung Wang, and Weileun Fang, “Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration”, J. Micromech. Microeng., 18, 2008.
  • 2. C.-W. Lin, C.-P. Hsu, H.-A. Yang, W. C. Wang, and W. Fang, “Implementation of SOG Devices with Embedded Through-wafer Silicon Vias Using a Novel Glass Reflow Process for Wafer-level 3D MEMS Integration,” IEEE MEMS’08, Tucson, AZ, USA, 2008.
  • 3. Chia-Pao Hsu, Wen-Chien Chen, Tsung-Lin Tang, Ming-Chuen Yip, Weileun Fang, ”The two-axis magnetostatic-drive single-crystal-Si micro scanner driven by back-side electroplating Ni film”, IEEE/LEOS Optical MEMS and Nanophotonics ‘08, Freiburg, DE, 2008.
  • 4. Chia-Pao Hsu, Deng-Horng Tsai, Ming-Chuen Yip, and Weileun Fang, “Decoupled Z-axis Microgyroscope Using Oblique Comb for Frequency Tuning”, IEEE Sensor’07, Atlanta, USA, 2007.
  • 5. Chia-Pao Hsu, Ming-Chuen Yip, and Weileun Fang, “A Novel SOI Z-axis Accelerometer with Gap Closing Differential Sensing Electrodes”, Transducers‘09, Colorado, USA, 2009. (NSC-96-2628-E-007-007-MY3)
  • 6. Chun-Kai Chan, Chia-Pao Hsu, Mingching Wu, Hong Hochen, Rong-Shun Chen, and Weileun Fang, “A Novel Differential Capacitive-Sensing Dual-axis Accelerometer Design Using Pendulum-Proofmass, Gimbal-springs, and Harm Vertical-combs”, Transducers‘09, Colorado, USA, 2009. (NSC 95-2221-E-007 -068 -MY3)
  • 7. Tsung-Lin Tang, Chia-Pao Hsu, Wen-Chien Chen, and Weileun Fang, “The Double-Side Electroplating and Slender Ferromagnetic Patterns Torque-Enhancement Design For Magnetostatic Actuator”, Transducers‘09, Colorado, USA, 2009.
  • 8. Chia-Pao Hsu, Ming-Chuen Yip, and Weileun Fang, “Implementation of Gap-Closing Differential Capacitive Sensing Z-axis Accelerometer on SOI Wafer”, J. Micromech. Microeng., 19, 2009
  • 學歷：
  • 中興大學機械系、交通大學機械所、清華大學動機所
  • 經歷：
  • TSMC MEMS RD 2009~2013, focus on 1. Motion sensor platform development . TSMC SSIPED PE 2013~, focus on 1. Motion sensor device characterisation, yield improvement, and failure analysis (both in platform and phase in project) 2. 3DIC development : including a. advanced package; b. TSV package
  • 個人專長：
  • 全國大專盃八人制拔河錦標賽第三名、第二屆北機盃羽球季軍
  • 研究方向：
  • SOI-based motion sensor
  • 連絡地址與電話：
  • Department of Power Mechanical Engineering, National Tsing Hua University (NTHU)101, Section 2 Kuang Fu Road, Hsinchu,Taiwan 30013, R.O.C.TEL: +886-3-5715131#33739. Cellphone:+886-0988934347
  • E-Mail：
  • d937730@oz.nthu.edu.tw