Surface Micro-
machining Platform
High-Aspect-Ratio
Process Platform
Packaging & System
integration
Thin Flim Mechanical
Properties Testing
- Young's Modulus
- Shear Modulus
- Poisson's Ratio
- Residual Stress
- Thermal Expansion
Coefficient - Natural Frequency
- Quality Factor
CMOS-MEMS
Carbon Nanotubes
Micro Scanners
Probes
晶圓級封裝(wafer-level package)
Localized Induction Heating assistance Solder Bonding
Bond Strength Testing Results
Temperature Distribution Testing
Leakage Test
