Surface Micro-
machining Platform

• MUMPs-like
• MOSBE

High-Aspect-Ratio
Process Platform

• BELST
• DAWN

Packaging & System
integration

• 1st level package
• wafer level package
  introduction
• wafer level package
  TSV
• system integration

Thin Flim Mechanical
Properties Testing

• Young's Modulus
• Shear Modulus
• Poisson's Ratio
• Residual Stress
• Thermal Expansion
  Coefficient
• Natural Frequency
• Quality Factor

CMOS-MEMS

• Inertia
• Optical applications

Carbon Nanotubes

• structure
• actuator

Micro Scanners

• scanning morror

Probes

• 3D Multi-Electro Array
• Micro-electro array
  with dye injection
• Probe with built-in
  load sensors

第一階封裝(1st level package)

Micro Scanner on Metal Can

CMOS MEMS in DIP

NTHU PME Micro Device Laboratory, Mo. 101 Sec2, guangfu Rd. Hsinchu, Taiwan 300 All rights reserved
Micro Device Laboratory Department of Power Mechanical Engineering,
MEMS Inst.National Tsing Hua University, Taiwan Tel:886-3-571-5131 Ext:33742 Fax:886-3-573-9372