1. W. Fang, 1999, “Determining of Elastic Constants of Thin Film Materials Using Self-deformed Micromachined Cantilevers,” Journal of Micromechanics and Microengineering, Vol. 9, pp. 230-235. (Corresponding author)
  2. W. Fang, C.-H. Lee, and H.-H. Hu, 1999, “On the Buckling Behavior of Micromachined Beams,” Journal of Micromechanics and Microengineering, Vol. 9, pp. 236-244. (Corresponding author)
  3. J. Hsieh and W. Fang, 2000, “A Novel Microelectrostatic Torsional Actuator,” Sensors and Actuators A, Vol. 79, pp. 64-70. (Corresponding author)
  4. C. Tsou and W. Fang, 2000, “The Effect of Residual Stresses on the Deformation of Semi-circular Micromachined Beams,” Journal of Micromechanics and Microengineering, Vol. 10, pp. 34-41. (Corresponding author)
  5. H.-Y. Lin and W. Fang, 2000, “The Rib-Reinforced Micromachined Beam and Its Application,” Journal of Micromechanics and Microengineering, Vol. 10, pp 93-99. (Corresponding author)
  6. S.-T. Hung, S.-C. Wong, and W. Fang, 2000, “The Development and Appication of Micro Thermal Sensors with a Supporting Mesh-Membrane Structure,” Sensors and Actuators A Vol. 84, pp. 70-75. (Corresponding author)
  7. W. Fang, and C.-Y. Lo, 2000, “On the Thermal Expansion Coefficients of Thin Films,” Sensors and Actuators A, Vol. 84, pp. 310-314. (Corresponding author)
  8. C. Tsou, H. Yin, and W. Fang, 2001, “On the Out-of-plane Deformation of V-shaped Micromachined Beams,” Journal of Micromechanics and Microengineering, Vol. 11, pp. 153-160. (Corresponding author)
  9. C.-A. Jong, W. Fang, C.-M. Lee, and T.-S. Chin, 2001 “Mechanical properties of phase-change recording media: GeSbTe films,” Japanese Journal of Applied Physics Vol. 40, pp. 3320-3325. (Collaboration with Prof. Chin at MSE Dept., NTHU)
  10. W.-P. Lai, and W. Fang, 2001, “A Novel Anti-Stiction Method Using Harmonic Excitation on the Microstructure,” Journal of Vacuum Science and Technology A Vol. 19, pp. 1224-1228. (Corresponding author)
  11. H.-H. Hu, H.-Y. Lin, B.C.-S. Chou, and W. Fang, 2001, “The diagnostic micromachined beams on (111)substrate,” Sensors and Actuators A, Vol. 93, pp. 258-265. (Corresponding author)
  12. C.-A. Jong, T.-S. Chin, and W. Fang, 2001, “Residual stress and thermal expansion behavior of TaOxNy films by the micro-cantilever method,” Thin Solid Films, Vol. 401, pp. 291-297. (Collaboration with Prof. Chin at MSE Dept., NTHU)
  13. W.-P. Lai, and W. Fang, 2002, “Novel Bulk Acoustic Wave Hammer to Determinate the Dynamic Response of Microstructures Using Pulsed Broad Bandwidth Ultrasonic Transducers,” Sensors and Actuators A, Vol. 96, pp. 43-52. (Corresponding author)
  14. J. Hsieh and W. Fang, 2002, “A Boron Etch-stop Assisted Lateral Silicon Etching Process for Improved High-aspect-ratio Silicon Micromachining and Its Applications,” Journal of Micromechanics and Microengineering, Vol. 12, pp. 574-581. (Corresponding author)
  15. W.-P. Lai and W. Fang, 2002, “Improvement of Bulk Acoustic Wave Hammer for Vibration Testing of Microstructures Using 1-3 Composite Transducer,” Sensors and Actuators A, Vol. 101, pp. 99-106. (Corresponding author)
  16. W.-C. Chen, C.-C. Chu, J. Hsieh, and W. Fang, 2003, “A Reliable Single-layer Out-of-plane Micromachined Thermal Actuator,” Sensors and Actuators A, Vol. 103, pp. 48-58. (Corresponding author)
  17. H.-C. Tsai and W. Fang, 2003, “Determining the Poisson’s Ratio of Thin Film Materials Using Resonant Method,” Sensors and Actuators A, Vol. 103, pp. 377-383. (Corresponding author)
  18. H.-Y. Lin and W. Fang, 2003, “A Reinforced Micro-torsional-mirror Driven by Electrostatic Torque Generators,” Sensors and Actuators A, Vol. 105, pp. 1-9. (Corresponding author)
  19. W. Tan, M. Wu, and W. Fang, 2003, “Novel MUMPs-compatible single-layer Out-of-plane Electrothermal Actuator,” Journal of Microlithography, Microfabrication and Microsystems, Vol. 2, pp. 91-95. (Corresponding author)
  20. Y.-J. Lai, C. Lee, C.-Y. Wu, W.-C. Chen, C. Chen, Y.-S. Lin,W. Fang, and R.-S. Huang, 2003, “Development of electrothermal actuator with optimized motion characteristics,”Jap. J. of Appl. Phys., Vol. 42, pp. 4067-4073.
  21. J. M.-L. Tsai, H.-Y. Chu, J. Hsieh, and W. Fang, 2004, “The BELST II Process for Silicon HARM Vertical Comb Actuator and Its Applications,” Journal of Micromechanics and Microengineering, Vol. 14, pp. 235-241.
  22. H.-Y. Chu and W. Fang, 2004, “A Novel Vertical Convex Corner Compensation for Wet Anisotropic Bulk Micromachining,” Journal of Micromechanics and Microengineering, Vol. 14, pp. 806-831.
  23. S.-H. Shen, W. Fang, S.-T. Young, 2004, “Design Considerations for an Acoustic MEMS Filter,” Microsystem Technologies, Vol. 10, pp. 585-591.
  24. H. Hocheng, K.S. Kao, and W. Fang, 2004, “Fatigue Life of a Microcantilever Beam in Bending”, Journal of Vacuum Science Technology A, Vol. 22, pp. 3143-3146.
  25. C. Yu, C. Hsu, and W. Fang, 2005, “Comments on Determining the Elastic Modulus of Thin Film Using the Micromachined Free-Free Beam,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 351-357.
  26. H. Yang, M. Wu, and W. Fang, 2005, “Localized Induction Heating Solder Bonding for Wafer Level MEMS Packaging,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 394-399.
  27. W.-P. Lai and W. Fang, 2005, “Determining the In-plane and Out-of-plane Dynamic Response of Microstructures Using Pulsed Dual-Mode Ultrasonic Array Transducers,” Sensors and Actuators A, Vol. 117, pp. 186-197.
  28. M. Wu, and W. Fang, 2005, “Design and Fabrication of MEMS Devices Using the Integration of MUMPs, Trench-refilled Molding, DRIE, and Bulk Silicon Etching Processes,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 535-542.
  29. C. Tsou, C. Hsu, and W. Fang, 2005, “Interfaces Friction Effect of Sliding Contact on Nanoindentation Test,” Sensors and Actuators A, Vol. 117, pp. 309-316.
  30. C.-C. Cheng and W. Fang, 2005, “Tuning the Quality Factor of Bulk Micromachined Structures Using the Squeeze Film Damping,” Microsystem Technologies, Vol. 11, pp. 104-110.
  31. H.-Y. Chu and W. Fang, 2005, “Bulk Micromachining Fabrication Platform Using the Integration of DRIE and Wet Anisotropic Etching,” Microsystem Technologies, Vol. 11, pp. 141-150.
  32. Y.-P. Ho, M. Wu, H.-Y. Lin, and W. Fang, 2005, “A Robust and Reliable Stress-induced Self-assembly Supporting Mechanism for Optical Devices,” Microsystem Technologies, Vol. 11, pp. 214-220.
  33. Y. Chiu, C.-H. Chen, J.-C. Chiou, W. Fang, and H.-P.D. Shieh, 2005, “MEMS-based Miniature Optical Pickup,” IEEE Trans. on Magnetics, Vol. 41, pp. 967-970.
  34. W. Chen, C. Lee, C.-Y. Wu, and W. Fang, 2005, “A New Latched 2x2 Optical Switch Using Bi-directional Movable Electrothermal H-beam Actuators,” Sensors and Actuators A, Vol. 123-124, pp. 563-569.
  35. C.-H. Lin, J.-M. Lu, and W. Fang, 2005, “Encapsulation of FBAR Filters Using Wafer-level Microcap Array,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 1433-1438.




  1. C.-H. Lin, H.-R. Chen, and W. Fang, 2005, “Design and Fabrication of a Miniaturized Bulk Acoustic Filter by High Aspect Ratio Etching Process,” Journal of Microlithography, Microfabrication and Microsystems, Vol.4.
  2. W. Fang, H.-Y. Chu, W.-K. Hsu, T.-W. Cheng, and N.-H. Tai, 2005, “Polymer reinforced aligned multi-walled carbon nanotube composites for MEMS applications,” Advanced Materials, Vol. 17, 2987-2992.
  3. H.-C. Chang, J. M.-L. Tsai, H.-C. Tsai, and W. Fang, 2005, “Design, Fabrication, and Testing of a 3-DOF HARM Micromanipulator on (111) Silicon Substrate,” Sensors and Actuators A, Vol. 125/2, pp. 438-445.
  4. Y.-C. Lin, H. Hocheng, W. Fang, and R.-S. Chen, 2005, “Fabrication and Fatigue Testing of an Electrostatically Driven Microcantilever Beam”, Materials and Manufacturing Processes.
  5. H.-C. Chang, J. M.-L. Tsai, H.-C. Tsai, and W. Fang, 2005, “Design, Fabrication, and Testing of a 3-DOF HARM Micromanipulator on (111) Silicon Substrate,” Sensors and Actuators A, Vol. 125/2, pp. 438-445.
  6. D.-H. Tsai, and W. Fang, 2005, “Design and Simulation of a Dual-axis Sensing Decoupled Vibratory Wheel Gyroscope,” Sensors and Actuators A, Vol. 126, pp.
  7. H.-A. Yang, C.-W. Lin, and W. Fang, 2005, “Wafer Level Self-Assembly of Microstructures Using the Global Magnetic Lifting and Localized Induction Welding,” Journal of Micromechanics and Microengineering, Vol. 16, pp. 27-32.
  8. W.-S. Su, S.-T. Lee, C.-Y. Lin, M.-S. Tsai, and W. Fang, 2005, “Tuning the Shape and Curvature of Micromachined Cantilever Using Multiple Plasma Chemistry Bonding Technology,” Sensors and Actuators A, (accepted).
  9. M. Wu, and W. Fang, 2005, “The Molded Surface-micromachining and Bulk Etching Release (MOSBE) Fabrication Platform on (111) Si for MOEMS,” Journal of Micromechanics and Microengineering.
  10. M. Wu, S.-Y. Hsiao, C.-Y. Peng, and W. Fang, 2005, “Development of Tracking and Focusing Micro Actuators for Dual-stage Optical Pick-up Head,” J. of Optics A, Vol.8, pp. 323-329.
  11. W.-M. Shen and W. Fang, 2005, “Design of Curve Arch Structures for Simplified Clutches,” JCSME, (revised).
  12. C. Hsu, C. Yu, C.-F. Tsou, and W. Fang, 2005, “Determining the Thin Film Elastic Modulus Using the Bending Test of Micromachined Cantilever by Nano-indenter,” Journal of Micromechanics and Microengineering, (submitted).
  13. H.-Y. Chu, T.-Y. Kuo, B. Chang, S.-W. Lu, C.-C. Chiao, and W. Fang, 2005, “Design and Fabrication of Novel Three Dimensional Multi-electrode Array Using SOI Wafer,” Sensors and Actuators A, Vol 130-131, pp. 254-261.
  14. M. Wu, H.-Y. Lin, and W. Fang, 2006, “A Poly-Si Based Vertical Comb-drive Two-axis Gimbaled Scanner for Optical Applications,” IEEE Journal of Photonics Technology Letters, Vol 18, pp 2111-2113 (corresponding author).
  15. S.-Y. Lee, H.-W. Tung, W.-C. Chen, and W. Fang, 2006, “Thermal Actuated Solid Tunable Lens,” IEEE Journal of Photonics Technology Letters, Vol 18, pp 2191-2193. (corresponding author).
  16. W.-S. Su, S.-T. Lee, C.-Y. Lin, M.-C. Yip, M.-S. Tsai, and W. Fang, 2006, “Control the Shape of Buckling Micromachined Beam Using Plasma Chemistry Bonding Technology,” Japanese Journal of Applied Physics, Vol. 45, pp. 8479-8483 (corresponding author).
  17. Y.-C. Lee, S.-J. Lin, C.-Y. Lin, M.-C. Yip, W. Fang, and I.-N. Lin, 2006, “Pre-nucleation Techniques for Enhancing Nucleation Density and Adhesion of Low Temperature Deposited Ultra-nanocrystalline Diamond,” Diamond and Related Materials, Vol. 15, pp. 2046-2050.
  18. J.-H. Lee, S.-T. Lee, C.-M. Yao, and W. Fang, 2007, “Comments on the Size Effect of Microcantilever Quality Factor in Free Air Space,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 139-146 (corresponding author).
  19. W.-S. Su, M.-S. Tsai, and W. Fang, 2007, “A Three Dimensional Micro Fabrication Technology on Highly Structured Surfaces,” Electrochemical and Solid-State Letters, Vol. 10, pp. H16-H19 (corresponding author, also appeared in Virtual Journal of Nanoscale Science & Technology, 2006, 14, Issue 21).
  20. C. Wang, H.-H. Yu, M. Wu, and W. Fang, 2007, “Implementation of Phase-Locked Loop Control for MEMS Scanning Mirror Using DSP,” Sensors and Actuators A, Vol. 133, pp. 243-249 (corresponding author).
  21. H.-D. Cheng, S.-Y. Hsiao, M. Wu, and W. Fang, 2007, “Integrated Tracking and Focusing Systems of MEMS Optical Pickup Head,” IEEE Trans. on Magnetics, Vol. 43, pp. 805-807 (corresponding author).
  22. Y. Chiu, J.-C. Chiou, W. Fang, Y.-J. Lin, and M. Wu, 2007, “Design, Fabrication, and Control of Components in MEMS-Based Optical Pickups,” IEEE Trans. on Magnetics, Vol. 43, pp. 780-784.
  23. C.-W. Lin, H.-A. Yang, W. C. Wang, and W. Fang, 2007, “Implementation of three dimensional SOI-MEMS wafer level packaging using through-wafer interconnections,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1200-1205 (corresponding author).
  24. H.-C. Zeng, Y.-C. Ho, S.-T. Chen, H.-I. Wu, H.-W. Tung, W. Fang, and Y.-C. Chang, 2007, “Studying the formation of large cell aggregates in patterned neuronal cultures,” Journal of Neuroscience Methods, Vol. 165, pp. 72-82.
  25. C. Wang, M.-H. Tsai, C.-M. Sun, and W. Fang, 2007, “A novel CMOS out-of-plane accelerometer with fully-differential gap-closing capacitance sensing electrodes,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1275-1280 (corresponding author).
  26. J. Hsieh, S.-Y. Hsiao, C.-F. Lai, and W. Fang, 2007, “Integration of UV Curable Polymer Lens and MUMPs Structure on SOI Optical Bench,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 1703-1709 (corresponding author).
  27. H.-A. Yang, T.-L. Tang, S.-T. Lee, and W. Fang, 2007, “A Novel Coil-less Scanning Mirror Using Eddy Current Lorentz Force and Magnetostatic Force,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 16, pp. 511-520 (corresponding author).
  28. W.-M. Shen and W. Fang, 2007, “Using Dual Belleville Structure to Design a Slip Clutch,” ASME J. of Mech. Design, (accepted, corresponding author).
  29. C. Hsu, C. Tsou, and W. Fang, 2007, “Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter,” Journal of Microlithography, Microfabrication and Microsystems, Vol. 6, pp. 033011-1-033011-7.
  30. H.-L. Yin, Y.-C. Huang, W. Fang, and J. Hsieh, 2007, “A novel electromagnetic elastomer membrane actuator with a semi-embedded coil,” Sensors and Actuators A, Vol. 139, pp.194-202.
  31. S.-Y. Lee, W.-C. Chen, H.-W. Tung, and W. Fang, 2007, “Microlens with Tunable Astigmatism,” IEEE Journal of Photonics Technology Letters, Vol. 19, pp. 1383-1385(corresponding author).
  32. M. Wu, H.-Y. Lin, and W. Fang, 2007, “Design of Novel Sequential Engagement Vertical Comb Electrodes for Analog Micro-mirror,” IEEE Journal of Photonics Technology Letters, Vol. 19, pp. 1586-1588 (corresponding author).
  33. W.-C. Chen, P.-I. Yeh, C.-F. Hu, and W. Fang, 2007, “Design and Characterization of Single-layer Step-bridge Structure for Out-of-plane Thermal Actuator,” IEEE/ASME Journal of Microelectromechanical Systems, (accepted, corresponding author).




  1. C.-M. Lin, W.-C. Chen, and W. Fang, 2007, “Removable Fast Package Technology for MEMS Devices Using Polymer Connectors and Silicon Sockets,” Journal of Micromechanics and Microengineering, (revised, corresponding author).
  2. C.-C. Wen, and W. Fang, 2007, “Tuning the Sensing Range and Sensitivity of 3 Axes Tactile Sensors Using the Polymer Composite Membrane,” Sensors and Actuators A, (revised, corresponding author).
  3. C.-M. Sun, C.-W. Wang, and W. Fang, 2007, “On the Sensitivity Improvement of CMOS Capacitive Accelerometer,” Sensors and Actuators A, (revised, corresponding author).
  4. H.-Y. Chu, and W. Fang, 2007, “The SOI DAWN Process for Three-dimensional Silicon Micromachining and Its Applications,” Sensors and Actuators A, (revised, corresponding author).
  5. H.-Y. 76. C.-M. Sun, C.-W. Wang, and W. Fang, 2008, “On the Sensitivity Improvement of CMOS Capacitive Accelerometer,” Sensors and Actuators A, Vol. 141, pp. 347-352 (corresponding author).
  6. W.-K. Hsu, H.-Y. Chu, T.-H. Chen, T.-W. Cheng, and W. Fang, 2008, “Exceptional bimorph effect and low quality factor from carbon nanotube-polymer composites,” Nanotechnology, Vol. 19, pp. 1-4 (corresponding author).
  7. 82. W.-C. Chen, P.-I. Yeh, C.-F. Hu, and W. Fang, 2008, “Design and Characterization of Single-layer Step-bridge Structure for Out-of-plane Thermal Actuator,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 17, pp. 70-77 (corresponding author).
  8. C.-W. Lin, C.-P. Hsu, H.-A. Yang, W. C. Wang, and W. Fang, 2008, “Implementation of SOG MEMS devices with embedded through-wafer silicon vias using glass reflow process for wafer-level packaging and 3D chip integration,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 025018, pp.1-7 (corresponding author).,
  9. L.-J. Chen, C.-C. Liu, N.-H. Tai, C.-Y. Lee, W. Fang, and I.-N. Lin, 2008, “Effects of tungsten metal coatings on enhancing the characteristics of ultrananocrystalline diamond films,” J. of Physical Chemistry C, Vol. 112, pp.3759-3765.
  10. B.-H. Jang, P.-H. Tseng, and W. Fang, 2008, “Characterization of Micro-Contact Properties Using a Novel Micromachined Apparatus,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 055020, pp.1-7 (corresponding author).
  11. C.-C. Wen, and W. Fang, 2008, “Tuning the Sensing Range and Sensitivity of 3 Axes Tactile Sensors Using the Polymer Composite Membrane,” Sensors and Actuators A, Vol. 145-146, pp.14-22 (corresponding author).
  12. W.-S. Su, H.-Y. Huang, and W. Fang, 2008, “Tuning the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for MEMS Applications,” Japanese Journal of Applied Physics, Vol. 47, pp.5242-5247 (corresponding author).
  13. S.-Y. Hsiao, C.-C. Lee, and W. Fang, 2008, “Implementation of concave micro optical devices using polymer dispensing technique,” Journal of Micromechanics and Microengineering, Vol. 18, Art. No 085009, pp.1-7 (corresponding author)
  14. H.-Y. Chu, C.-M. Lin, and W. Fang, 2008, “The SOI DAWN Process for Three-dimensional Silicon Micromachining and Its Applications,” Sensors and Actuators A, Vol. 147, pp.656-664 (corresponding author).
  15. Y.-C. Lee, S.-J. Lin, V. Buck, R. Kunze, H. Schmidt, C.-Y. Lin, W. Fang, and I.-N. Lin, 2008, “Surface Acoustic Wave Properties of Natural Smooth Ultra-nanocrystalline Diamond Characterized by Laser-induced SAW Pulse Technique,” Diamond and Related Materials, Vol. 17, pp. 446-450.
  16. U.A., Palnitkar, P.T., Joseph, H. Niu, H.-Y. Huang, W. Fang, H.-F. Cheng, N.-H. Tai, and I.-N. Lin, 2008, “Adhesion Properties of Nitrogen Ion Implanted Ultra-nanocrystalline Diamond Films on Silicon Substrate,” Diamond and Related Materials, Vol. 17, pp. 864-867.
  17. C.-M. Sun, C. Wang, M.-H. Tsai, H.-S. Hsieh, and W. Fang, 2009, “Monolithic Integration of Capacitive Sensors Using Double-side CMOS MEMS Post Process,” Journal of Micromechanics and Microengineering, Vol. 19, Art. No 015023, pp.1-9 (corresponding author).
  18. C.-M. Lin, Y.-T. Lee, S.-R. Yeh, and W. Fang, 2009, “Flexible Carbon Nanotubes Electrode for Neural Recording,” Biosensors and Bioelectronics, Vol. 24, pp.2791-2797 (corresponding author).
  19. B.-H. Jang, H.-Y. Huang, and W. Fang, 2009, “A Novel Zero-insertion-force (ZIF) Micro(m)-connector: Design, Fabrication, and Measurements,” IEEE Transactions on Industrial Electronics, Vol. 56, pp.1040-1047. (corresponding author).
  20. C.-L. Wu, M.-C. Yip, and W. Fang, 2009, “Improvement of Specimen Preparation Process for Bulge Test Using the Combination of Deep Reactive Ion Etching and XeF2 Etching,” Japanese Journal of Applied Physics, Vol.48., 06FK06 (corresponding author).
  21. C.-P. Hsu, M.-C. Yip, and W. Fang, 2009, “Implementation of Gap-Closing Differential Capacitive Sensing Z-axis Accelerometer on SOI Wafer,” Journal of Micromechanics and Microengineering, Vol. 19, Art. No 075006, pp.1-7 (corresponding author).
  22. Y. Chiu, H.-F. Shih, J.-C. Chiou, S.-T. Cheng, K.-Y. Hung, F.-G. Tseng, and W. Fang, 2009 “Design and Fabrication of a Small-Form-Factor Optical Pickup Head,” IEEE Trans. on Magnetics, Vol. 45, pp.2194-2197.
  23. C.-L. Wu, F.-L. Pan, C.-F. Tuan, S.-J. Chen, W. Fang, M.-C. Yip, 2009, “Measurement Uncertainty of Nano Bionix Universal Testing System,” Sensors and Materials, Vol. 20, pp.351-363.
  24. C.-L. Wu, H.-C. Lin, J.-S. Hsu, M.-C. Yip, and W. Fang, 2009, “Static and Dynamic Mechanical Properties of Polydimethylsiloxane/Carbon Nanotubes Nanocomposites,” Thin Solid Films, Vol. 517, pp.4895-4901.
  25. M.-H. Tsai, C.-M. Sun, Y.-C. Liu, C. Wang, and W. Fang, 2009, “Design and Application of Metal Wet-etching Post Process for the Improvement of CMOS-MEMS Capacitive Sensors,” Journal of Micromechanics and Microengineering, accepted (corresponding author).
  26. C.-W. Lin, Y.-T. Lee, C.-W. Chang, W.-L. Hsu, Y.-C. Chang, and W. Fang, 2009, “Novel Glass Microprobe Arrays for Neural Recording,” Biosensors and Bioelectronics, accepted (corresponding author).
  27. W.-S. Su, C.-M. Lin, T.-H. Chen, and W. Fang, 2009, “Patterning and Growth of Carbon Nanotubes on Highly Structured 3D Substrate Surface,” Journal of Micromechanics and Microengineering, accepted (corresponding author).