Surface Micro-
machining Platform

• MUMPs-like
• MOSBE

High-Aspect-Ratio
Process Platform

• BELST
• DAWN

Packaging & System
integration

• 1st level package
• wafer level package
  introduction
• wafer level package
  TSV
• system integration

Thin Flim Mechanical
Properties Testing

• Young's Modulus
• Shear Modulus
• Poisson's Ratio
• Residual Stress
• Thermal Expansion
  Coefficient
• Natural Frequency
• Quality Factor

CMOS-MEMS

• Inertia
• Optical applications

Carbon Nanotubes

• structure
• actuator

Micro Scanners

• scanning morror

Probes

• 3D Multi-Electro Array
• Micro-electro array
  with dye injection
• Probe with built-in
  load sensors

晶圓級封裝(wafer-level package)

Localized Induction Heating assistance Solder Bonding

Bond Strength Testing Results

Temperature Distribution Testing

Leakage Test