Surface Micro-
machining Platform

• MUMPs-like
• MOSBE

High-Aspect-Ratio
Process Platform

• BELST
• DAWN

Packaging & System
integration

• 1st level package
• wafer level package
  introduction
• wafer level package
  TSV
• system integration

Thin Flim Mechanical
Properties Testing

• Young's Modulus
• Shear Modulus
• Poisson's Ratio
• Residual Stress
• Thermal Expansion
  Coefficient
• Natural Frequency
• Quality Factor

CMOS-MEMS

• Inertia
• Optical applications

Carbon Nanotubes

• structure
• actuator

Micro Scanners

• scanning morror

Probes

• 3D Multi-Electro Array
• Micro-electro array
  with dye injection
• Probe with built-in
  load sensors

In traditions, MEMS Capacitive accelerometer consists of a proof mass, supporting springs, sensing electrodes, self-diagnostic actuators, and curvature matching frame. The proof mass of the spring-mass system will be excited after subject-ing to the acceleration. 　

Thus, the motion of the proof mass will lead to the capacitance change of sensing electrodes, so as to determine the acceleration.

In-Plane CMOS Accelerometer

Out-of-plane CMOS Accelerometer

CMOS Vibratory Gyroscope

CMOS Vibratory Gyroscope

CMOS Vibratory Gyroscope